| Tweet | |
| 福光嘉伸, "スリーブはんだ付け装置の圧力変化を用いた自動検査法," , 2022年2月. | |
| ID | 200 |
| 分類 | 学位論文・卒論・特別研究 |
| タグ | |
| 表題 (title) |
スリーブはんだ付け装置の圧力変化を用いた自動検査法 |
| 表題 (英文) |
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| 著者名 (author) |
福光嘉伸 |
| 英文著者名 (author) |
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| キー (key) |
Yoshinobu Fukumitsu |
| 刊行月 (month) |
2 |
| 出版年 (year) |
2022 |
| 刊行形式 (howpublished) |
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| URL |
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| 付加情報 (note) |
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| 注釈 (annote) |
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| 内容梗概 (abstract) |
Solder joint significantly affects the quality of the electronic equipment. A sleeve soldering system is one of the soldering equipment. The system puts a heated ceramic sleeve over the through-hole of the print circuit board and melts the solder piece dropped into the sleeve. The system also feeds a certain amount of nitrogen gas into the sleeve continuously, and the gas goes out through the lower end of the sleeve. Therefore, pressure in the sleeve is changed by narrowing down or blocking the exit hole in each soldering process, such as the sleeve approaches to the print circuit board, drop off the solder piece, and solder melting. Here, the pressure at each process may differ between correct and incorrect soldering. In this paper, the author classifies solder filling in a through-hole and absence of back fillet from the pressure change's features. In previous study, the soldering system's developer labeled the correct and incorrect of the solder joint. However, the criterion that decides the correct/incorrect solder is different by soldering target, and other conditions. The results of the experiment show that solder filling in a through-hole are classified with 95.5% accuracy and absence of back fillet are classified with 93.3% accuracy. |
| 論文電子ファイル | 183.pdf (application/pdf) [一般閲覧可] |
| BiBTeXエントリ |
@misc{id200,
title = {スリーブはんだ付け装置の圧力変化を用いた自動検査法},
author = {福光嘉伸},
month = {2},
year = {2022},
}
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