K. Nakamichi, H. Fukuoka, A. Suda, and H. Uwano, "Effect of Sleeve Temperature in Sleeve Soldering on the Solder Melting Process and Pressure Fluctuation Inside the Sleeve," In AIP Conference Proceedings, 3086 090009, May 2024.
ID 237
分類 国際会議
タグ effect fluctuation inside melting pressure process sleeve solder soldering temperature
表題 (title) Effect of Sleeve Temperature in Sleeve Soldering on the Solder Melting Process and Pressure Fluctuation Inside the Sleeve
表題 (英文)
著者名 (author) Keita Nakamichi, Hiroshi Fukuoka, Atsushi Suda, Hidetake Uwano
英文著者名 (author) Keita Nakamichi,Hiroshi Fukuoka,,Hidetake Uwano
編者名 (editor)
編者名 (英文)
キー (key) Keita Nakamichi,Hiroshi Fukuoka,,Hidetake Uwano
書籍・会議録表題 (booktitle) AIP Conference Proceedings
書籍・会議録表題(英文)
巻数 (volume) 3086 090009
号数 (number)
ページ範囲 (pages)
組織名 (organization)
出版元 (publisher)
出版元 (英文)
出版社住所 (address)
刊行月 (month) 5
出版年 (year) 2024
採択率 (acceptance)
URL
付加情報 (note)
注釈 (annote)
内容梗概 (abstract)
論文電子ファイル 利用できません.
BiBTeXエントリ
@inproceedings{id237,
         title = {Effect of sleeve temperature in sleeve soldering on the solder melting process and pressure fluctuation inside the sleeve},
        author = {Keita Nakamichi and  Hiroshi Fukuoka and  Atsushi Suda and  Hidetake Uwano},
     booktitle = {AIP Conference Proceedings},
        volume = {3086 090009},
         month = {5},
          year = {2024},
}
  

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